| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 4 | |
| #2 | Taiwan | 4 | |
| #3 | China | 3 | |
| #4 | Republic of Korea | 2 | |
| #5 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Semiconductors | |
| #3 | Surface technology and coating | |
| #4 | Machine tools | |
| #5 | Audio-visual technology | |
| #6 | Optics | |
| #7 | Computer technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Layered products | |
| #3 | Shaping of plastics | |
| #4 | Unspecified technologies | |
| #5 | Soldering, welding and flame cutting | |
| #6 | Perforating | |
| #7 | Advertising | |
| #8 | Nonlinear optics | |
| #9 | Electric digital data processing |
| # | Name | Total Patents |
|---|---|---|
| #1 | Uemura Mitsuo | 12 |
| #2 | Mitsuo Uemura | 2 |
| Publication | Filing date | Title |
|---|---|---|
| JP2018176328A | Punching device and punching method | |
| JP2018161804A | Bonding apparatus and bonding method | |
| JP2018008464A | Lamination device and lamination method | |
| JP2017220537A | Method and device for separating workpiece comprising carrier substrate and resin layer | |
| TW201634978A | Attaching device | |
| TW201442876A | Adhesive device |