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SCHNEIDER ELECTRIC JAPAN HOLDINGS LTD

Overview
  • Total Patents
    30
  • GoodIP Patent Rank
    54,380
  • Filing trend
    ⇧ 66.0%
About

SCHNEIDER ELECTRIC JAPAN HOLDINGS LTD has a total of 30 patent applications. It increased the IP activity by 66.0%. Its first patent ever was published in 2013. It filed its patents most often in Japan, EPO (European Patent Office) and China. Its main competitors in its focus markets computer technology, control and packaging and shipping are ANHUI HONGCHENG OPTOELECTRONICS CO LTD, TOWER TECH SRL and DAVIDSON PHILIP L.

Patent filings in countries

World map showing SCHNEIDER ELECTRIC JAPAN HOLDINGS LTDs patent filings in countries
# Country Total Patents
#1 Japan 20
#2 EPO (European Patent Office) 4
#3 China 2
#4 United States 2
#5 WIPO (World Intellectual Property Organization) 2

Patent filings per year

Chart showing SCHNEIDER ELECTRIC JAPAN HOLDINGS LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Terada Toru 6
#2 Sawaguchi Mamoru 5
#3 Iwano Kenji 5
#4 Ebisuno Soichi 4
#5 Keiya Osamu 3
#6 Takase Yasufumi 2
#7 Saito Masao 2
#8 Bikram M Ey 2
#9 Ikezoe Tsuyoshi 2
#10 Tojo Hiromitsu 2

Latest patents

Publication Filing date Title
JP2020197856A Information display apparatus
JP2020190827A Screen creation device
JP2020091354A Screen display device
JP2020057283A Data processing device and display device
JP2020052681A Operation processing device
JP2020052680A Operation input control device
JP2020016922A Image generation apparatus
JP2019174990A Touch monitor and display system
JP2019101476A Operation guide system
JP2019101477A Numerical value input device
JP2019008661A Programmable display
JP2019003417A Terminal device and display system
JP2018156241A Authentication intermediation device and authentication intermediation program
JP2018137573A Communication relay device
JP2018106310A Memory controller
JP2018097149A Display unit
JP2018084865A Display control apparatus and display system
JP2018066936A Display control device
JP2018013926A Display control method
JP2018008732A Packaging shock-absorbing material