| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 7 | |
| #2 | Canada | 6 | |
| #3 | EPO (European Patent Office) | 6 | |
| #4 | Australia | 4 | |
| #5 | Taiwan | 4 | |
| #6 | United States | 4 | |
| #7 | China | 3 | |
| #8 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Materials and metallurgy | |
| #2 | Pharmaceuticals | |
| #3 | Electrical machinery and energy | |
| #4 | Machine tools | |
| #5 | Thermal processes | |
| #6 | Surface technology and coating | |
| #7 | Machines |
| # | Name | Total Patents |
|---|---|---|
| #1 | Oishi Keiichiro | 31 |
| #2 | Otani Junichi | 4 |
| #3 | Sasaki Isao | 4 |
| #4 | Keiichiro Oishi | 3 |
| #5 | Hokazono Takashi | 1 |
| #6 | Tanaka Shinji | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2004079026A1 | Heat-resisting copper alloy materials | |
| WO2004022805A1 | High-strength copper alloy | |
| US2002069942A1 | Lead-free free-cutting copper alloys | |
| US2002159912A1 | Copper/zinc alloys having low levels of lead and good machinability |