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SAIA BURGESS OLDENBURG GMBH &

Overview
  • Total Patents
    19
About

SAIA BURGESS OLDENBURG GMBH & has a total of 19 patent applications. Its first patent ever was published in 2003. It filed its patents most often in Germany, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets electrical machinery and energy, machines and audio-visual technology are MUSASHI KAKO KK, MITSUBISHI MATERIALS CMI CORP and CHANGHUI AUTO ELECTRIC HUANGSHAN JSC LTD.

Patent filings in countries

World map showing SAIA BURGESS OLDENBURG GMBH &s patent filings in countries

Patent filings per year

Chart showing SAIA BURGESS OLDENBURG GMBH &s patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Stenzel Bruno 9
#2 Falk Andreas 9
#3 Dengler Werner 5
#4 Doebrich Marco 4
#5 Koepsell Martin 4
#6 Erdmann Christian 3
#7 Bahr Joachim 2
#8 Weyand Carsten 2
#9 Stratmann Bernd 1
#10 Martin Koepsell 1

Latest patents

Publication Filing date Title
DE102008050908A1 Component carrier i.e. lock part, for e.g. switch for door lock of motor vehicle, has current conductor i.e. single-wired, flexible conductor wire, guided within housing, where surface of wire is surrounded by insulator
DE102008047457A1 Arrangement for connecting electrical conductor formed as foil with profile shape pin of electrical component, has connection formed without insertion of plumb with element penetrating foil
DE102007003567A1 Belt buckle for a safety belt
EP1921642A1 Electrical switch with a least one cabinet
EP1919033A1 Circuit arrangement with a plurality of electrical components
DE102006043795B3 Electric microswitch
DE102005052241A1 Welding equipment tool for joining two or more plastic components uses LED arrangement to heat components
DE102005042415A1 Circuit arrangement e.g. for motor vehicle door locks, uses stamped wire conduction element for interconnecting circuit components
DE102005036488A1 Electrical micro switch for particular use in automobiles has contact carrier having leaf spring form built into a cage
DE102004005850A1 Soldering electronic components onto a film, comprises applying a solder paste onto the component contacts, and melting the paste using a laser
DE10336139A1 Switch, in particular microswitch
DE10336140A1 Switch, in particular microswitch