|
US9054517B1
|
|
Smart diagnosis and protection circuits for ASIC wiring fault conditions
|
|
WO2013078006A1
|
|
Mechanical packaging technique of attaching mems and flex circuit
|
|
WO2013074351A2
|
|
Submersible electronic sensor
|
|
EP2567401A1
|
|
Process for minimizing chipping when separating mems dies on a wafer
|
|
US2011050353A1
|
|
Temperature compensated RC oscillator for signal conditioning ASIC using source bulk voltage of MOSFET
|
|
CN102132136A
|
|
Sensor device packaging and method
|
|
US7775119B1
|
|
Media-compatible electrically isolated pressure sensor for high temperature applications
|
|
WO2008060389A2
|
|
Sensor device package having thermally compliant die pad
|
|
US2007228499A1
|
|
MEMS device package with thermally compliant insert
|
