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REXTAC LLC

Overview
  • Total Patents
    11
  • GoodIP Patent Rank
    163,453
  • Filing trend
    ⇩ 100.0%
About

REXTAC LLC has a total of 11 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2012. It filed its patents most often in United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and machines are JIANG PEIJUN, WUXI HAITE NEW MAT INSTITUTE CO LTD and WUXI HAITE NEW MAT INST CO LTD.

Patent filings in countries

World map showing REXTAC LLCs patent filings in countries

Patent filings per year

Chart showing REXTAC LLCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sustic Andres 10
#2 Fowler Nick 7
#3 Passmore John 4
#4 Buenacosa Enrico L 4
#5 Haselman James 4
#6 Fowler James Nicholas 3
#7 Decair John J 3
#8 Arnold Mitchell 2
#9 Decair John Joseph 2
#10 Buenacosa Enrico 1

Latest patents

Publication Filing date Title
US2021009721A1 Process for pre-contacting metallocene catalyst components to produce amorphous poly alpha-olefins
US2020109221A1 High melt strength amorphous poly alpha olefin
US2019367784A1 Low molecular weight butene-1-co-hexene-1 amorphous poly alpha olefins for hot-melt adhesives with enhanced properties
US2021017306A1 Process for pre-contacting catalyst components ex-reactor to produce amorphous poly alpha-olefins
US2017292047A1 Hexene-1 Containing Amorphous Polyalphaolefins For Improved Hot Melt Adhesives
US2017088754A1 Propylene-based amorphous poly-alpha-olefins (APAOs) formulated with hexene-1 monomer containing amorphous poly-alpha-olefins for use in hot melt adhesives
US2016289511A1 APAO hot melt adhesives containing a low molecular weight, functionalized, isotactic polypropylene
US2016222258A1 Performance APAO hot melt adhesives containing high melt flow rate hydrogenated styrene block copolymers
US2015148473A1 APAO-based hot melt adhesives
WO2013055446A1 Composition and method for packaging polyolefin-based hot melt adhesives