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QUALTEC KK

Overview
  • Total Patents
    19
  • GoodIP Patent Rank
    116,307
  • Filing trend
    ⇩ 33.0%
About

QUALTEC KK has a total of 19 patent applications. It decreased the IP activity by 33.0%. Its first patent ever was published in 2005. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, electrical machinery and energy and audio-visual technology are PLAYNITRIDE DISPLAY TECH CO LTD, JIANGXI MTC SEMICONDUCTOR CO LTD and CREE HUIZHOU OPTO LTD.

Patent filings in countries

World map showing QUALTEC KKs patent filings in countries
# Country Total Patents
#1 Japan 19

Patent filings per year

Chart showing QUALTEC KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shikata Koichi 9
#2 Oya Reiji 5
#3 Ono Yukari 5
#4 Saito Hiroyuki 4
#5 Takahara Hiroshi 4
#6 Onodera Kota 3
#7 Nagata Yuki 2
#8 Shinko Hiroshi 2
#9 Sakata Shigeo 2
#10 Nakakihara Saki 2

Latest patents

Publication Filing date Title
JP2020204609A Electric element test device and electric element test method
JP2020201248A Electric element testing device and electric element testing method
JP2020177011A Structure analysis device and structure analysis method using ultrasonic wave, and computer program
JP2020140956A El display panel and manufacturing method thereof
JP2020077612A El display panel, el display device, manufacturing method of the el display panel, and manufacturing device of the el display panel
JP2021001810A Standard sample for impedance measurement
JP2020176851A Semiconductor device test apparatus and semiconductor device test method
JP2020173197A Semiconductor testing device and method for testing semiconductor element
JP2019071267A Method for manufacturing el display panel, device for manufacturing el display panel, el display panel, and el display device
JP2019129163A El display panel and el display device, and method for manufacturing el display panel and device for manufacturing el display panel
JP2019085631A Method for manufacturing electronic component, and electronic component
JP2019026879A Production method of electronic component, and electronic component
JP2018157173A Method for manufacturing power module, power module, method for manufacturing electronic component, and electronic component
JP2015137418A Wiring board and production method of wiring board
JP2015137394A electroless Ni-P plating solution and electroless Ni-P plating method
JP2015021178A ELECTROLESS Ni-P-Sn PLATING SOLUTION
JP2013144835A ELECTROLESS Ni-P-Sn PLATING SOLUTION
JP2013041904A Manufacturing method of substrate with solder bump
JP2007039547A Method for treating surface of resin board