| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 42 |
| # | Name | Total Patents |
|---|---|---|
| #1 | Gilman Paul S | 8 |
| #2 | Kulkarni Shailesh | 4 |
| #3 | Lam Raymond K F | 4 |
| #4 | Snowman Alfred | 3 |
| #5 | Hermanek Frank J | 3 |
| #6 | Kwok Doris | 3 |
| #7 | Hunt Thomas J | 3 |
| #8 | Sue Jiinjen A | 3 |
| #9 | Knapp James Kent | 3 |
| #10 | Lo Chi-Fung | 3 |
| Publication | Filing date | Title |
|---|---|---|
| JP2002220659A | Working and bonding of copper sputter target | |
| JP2001049426A | Manufacture of copper sputtering target, and assembly of copper sputtering target and backing plate | |
| JP2000256843A | Production of sputtering target for use and reuse in thin film vapor deposition, and sputtering vapor deposition target | |
| JP2001020056A | Titanium carbide/tungsten boride coating | |
| JP2001020055A | Chromium boride coating |