| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 15 |
| # | Industry | |
|---|---|---|
| #1 | Optics | |
| #2 | Electrical machinery and energy | |
| #3 | Surface technology and coating | |
| #4 | Audio-visual technology |
| # | Technology | |
|---|---|---|
| #1 | Optical systems | |
| #2 | Electric discharge tubes | |
| #3 | Coating metallic material | |
| #4 | Devices using light amplification | |
| #5 | Display controls |
| # | Name | Total Patents |
|---|---|---|
| #1 | Venkatesan Suresh | 12 |
| #2 | Florjanczyk Miroslaw | 6 |
| #3 | Ring William | 5 |
| #4 | Lam Yee Loy | 3 |
| #5 | Lam Loy Yee | 3 |
| #6 | Hall Trevor | 2 |
| #7 | Liu Peng | 2 |
| #8 | Yang Jing | 2 |
| #9 | Koh Long Cheng | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2021126429A1 | Planar Laser Structure with Vertical Signal Transition | |
| US2020257053A1 | Dual core waveguide | |
| US2019361180A1 | Method of forming an hermetic seal on electronic and optoelectronic packages | |
| US2019271810A1 | Optical dielectric planar waveguide process | |
| US10530125B1 | Vertical cavity surface emitting laser | |
| US2019227232A1 | Methods for optical dielectric waveguide subassembly structure | |
| US2019129099A1 | Wafer-level optoelectronic packaging |