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PHOENIX SILICON INT CORP

Overview
  • Total Patents
    44
  • GoodIP Patent Rank
    50,357
  • Filing trend
    ⇩ 25.0%
About

PHOENIX SILICON INT CORP has a total of 44 patent applications. It decreased the IP activity by 25.0%. Its first patent ever was published in 2002. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets measurement, medical technology and environmental technology are REN FAN, OPSOLUTION GMBH and UNIV BINZHOU MEDICAL.

Patent filings in countries

World map showing PHOENIX SILICON INT CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 28
#2 United States 7
#3 China 4
#4 EPO (European Patent Office) 4
#5 Japan 1

Patent filings per year

Chart showing PHOENIX SILICON INT CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Liao Hsueh-Chuan 16
#2 Tsai Hsin-Chuan 8
#3 Huang Chien-Hsiung 6
#4 Huang His-Che 6
#5 Tsou Chao-Tsung 6
#6 Lin Cheng-Yen 6
#7 Chen Yu-Che 5
#8 Chen Tzu-Hui 4
#9 Kao Tzu-Pai 4
#10 Yang Miin-Tsong 4

Latest patents

Publication Filing date Title
TW202102852A Linker of bioprobes
TWI702399B Linker of bioprobes
TW202102336A Wafer polishing method
TW202102845A Electrochemical sensor with three-dimensional structure electrodes
TW202102706A Crucible and vapor deposition apparatus
TW202102700A Evaporation process jig
TW202103220A Method of depositing a gold film on a silicon wafer
TW202103227A Taiko wafer ring cut process method
TWI675201B Working electrode of electrochemical sensor manufacturing method and product thereof
TWI663396B Working electrode of electrochemical sensor manufacturing method and product thereof
TW201902421A Blood sugar measuring apparatus
TW201812976A Non contact wafer table
US2018060941A1 Sectionalized apparatus and method for battery manufacturing process
CN107546104A A kind of wafer thinning preparation technology
TWI588880B Manufacturing process of wafer thinning
TW201724245A Method of increasing processing speed of through-silicon via increases the overall speed by deep silicon via etching and batch type etching process
TW201724420A Wafer having planarized through silicon via wall reducing the energy consumption of an electronic product
TW201546955A Manufacture process of wafer via holes
TW201519301A The process of raising the strength of silicon carrier board and its products
TW201519144A Battery process configuration device and method thereof