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PELNOX LTD

Overview
  • Total Patents
    38
  • GoodIP Patent Rank
    82,882
  • Filing trend
    ⇧ 60.0%
About

PELNOX LTD has a total of 38 patent applications. It increased the IP activity by 60.0%. Its first patent ever was published in 2010. It filed its patents most often in Japan, China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets macromolecular chemistry and polymers, electrical machinery and energy and basic materials chemistry are JIANGSU GAOKO LOGISTICS SCIENCE & TECHNOLOGY CO LTD, MOLES TECHNOLOGY A S and ANHUI RONGCHENG GLASS PRODUCTS CO LTD.

Patent filings in countries

World map showing PELNOX LTDs patent filings in countries

Patent filings per year

Chart showing PELNOX LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Moriuchi Fumio 14
#2 Iwamura Eiji 12
#3 Ishii Yuichi 10
#4 Sato Hideharu 8
#5 Takahashi Naoya 6
#6 Morozumi Yasutaka 6
#7 Komiyama Hirofumi 4
#8 Takashima Naohiro 4
#9 Itou Hirokatsu 4
#10 Sato Kenichiro 4

Latest patents

Publication Filing date Title
WO2019131353A1 Thermosetting composition and paste
CN110199362A Chip shape electronic component
JP2019059014A Composite material, hard material, and method for producing hard material
JP2020015822A Curable resin composition, cured product and method for producing the same, and article
JP2019077810A Insulating composition, chip resistor, method for manufacturing display body, and method for manufacturing chip resistor
CN108463508A Condensation reaction type polysiloxane composition and solidfied material
JP2017052924A Epoxy resin composition and cured product
JP2016191031A One-pack epoxy resin composition for semiconductor encapsulation, cured product, production method of semiconductor component, and semiconductor component
JP2015193825A Thermosetting type composition for flame retardant polyurethane resin, flame retardant polyurethane resin and flame retardant article, and battery pack
US2016024366A1 Heat-dissapating powder coating composition, heat-dissipating coating film, and coated article
KR20150089001A Conductive paste
JP2015115314A Electroconductive silver paste for laser etching, substrate for circuit board, and circuit board
JP2014107533A Conductive paste composition for laser etching
JP2014080555A Thermosetting composition, and thermosetting conductive paste
JP2014002992A Electroconductive paste composition for laser etching
JP2013245348A Ultraviolet-curing type resin composition, hard coat agent and hard coat film, and method for manufacturing the same
JP2013237826A Thermosetting resin composition, and insulating paste for protection film
JP2013213175A Adhesive composition for optical member and cured product thereof
JP2013143368A Aqueous conductive paste
JP2013124368A Rosin-modified polyvinyl acetal-based resin, method for producing the polyvinyl acetal-based resin, and resin composition