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PAN TZONG-SHII

Overview
  • Total Patents
    20
About

PAN TZONG-SHII has a total of 20 patent applications. Its first patent ever was published in 2006. It filed its patents most often in United States. Its main competitors in its focus markets audio-visual technology and machines are YAO MINGGAO, INTERDYNE CO and EPO SCIENCE & TECHNOLOGY INC.

Patent filings in countries

World map showing PAN TZONG-SHIIs patent filings in countries
# Country Total Patents
#1 United States 20

Patent filings per year

Chart showing PAN TZONG-SHIIs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Pan Tzong-Shii 20
#2 Ho Shufun 3
#3 Magsombol Fernando A 2
#4 Prateepphaisan Gunphai 2
#5 Bonin Wayne 1
#6 Ali Tahir A 1
#7 Berger David I 1
#8 Zhang Cliff 1
#9 Petdee Theerawat 1
#10 Chen Yih-Jen D 1

Latest patents

Publication Filing date Title
US8611052B1 Systems and methods for aligning components of a head stack assembly of a hard disk drive
US8295013B1 Disk drive head stack assembly having a flexible printed circuit with heat transfer limiting features
US8665566B1 Suspension tail design for a head gimbal assembly of a hard disk drive
US8488279B1 Disk drive suspension assembly with flexure having stacked interleaved traces
US8477459B1 Disk drive head gimbal assembly having a flexure tail with dual conductive layers and features to facilitate bonding
US8488281B1 Disk drive suspension assembly having a flexure bond pad shelf separate from a tongue
US8456776B1 Disk drive head gimbal assembly having a flexure bond pad shelf offset from a tongue
US8514522B1 Systems for interconnecting magnetic heads of storage devices in a test assembly
US8467153B1 Disk drive head gimbal assembly having a flexure tail with folded bond pads
US8792212B1 Robust gimbal design for head gimbal assembly
US8089730B1 Suspension assembly having a read head clamp
US8218268B1 Head gimbal assembly having a load beam aperature over conductive heating pads that are offset from head bonding pads
US8068314B1 Head stack assembly with suspension tails extending into interfering slits in a flexible printed circuit
US8279560B1 Head stack assembly with suspension tail bond alignment by solder pin
US9324346B1 Head stack assembly with a flexible printed circuit having a mouth centered between arms
US8142671B1 Method to fabricate a damped suspension assembly
US8194355B1 Head stack assembly with a laminated flexure having a snap-through feature
US8605389B1 Head gimbal assembly including a conductive trace disposed upon a continuous dielectric layer segment without overlying a gimbal arm