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PACTEL CORP

Overview
  • Total Patents
    37
About

PACTEL CORP has a total of 37 patent applications. Its first patent ever was published in 1977. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and EPO (European Patent Office). Its main competitors in its focus markets telecommunications, audio-visual technology and basic communication technologies are CINTERION WIRELESS MODULES, UBINETICS VPT LTD and GAVRILOVICH CHARLES D.

Patent filings per year

Chart showing PACTEL CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee William Chien-Yeh 14
#2 Lee William C 6
#3 Lee William C Y 4
#4 Nogavich Daniel 3
#5 Lebow Sanford 3
#6 Lee William Chien-Yeh Lee 2
#7 Sprecher Jerry Wayne 2
#8 Chou Simon 2
#9 Nogavich Eugene 2
#10 Harrington Darryl F 1

Latest patents

Publication Filing date Title
WO9406227A1 A spectrum sharing communications system
WO9403986A1 Computer-implemented modelling system for wireless communications systems
WO9310619A1 Inbuilding telephone communication system
WO9311482A1 A real-time running averaging device
US5285494A Network management system
US5193109A Zoned microcell with sector scanning for cellular telephone system
US5216703A Piggy-back number and routing isolation for cellular telephone switches
US5067147A Microcell system for cellular telephone system
US5243598A Microcell system in digital cellular
US5220680A Frequency signal generator apparatus and method for simulating interference in mobile communication systems
WO9107043A1 Improved microcell system for cellular telephone systems
WO9107019A1 Zoned microcell with sector scanning for cellular telephone systems
US5081703A Satellite mobile communication system for rural service areas
US4932049A Cellular telephone system
US4306925A Method of manufacturing high density printed circuit
DE2921830A1 High-density fine-line printed circuits prodn. - by forming circuit on a substrate, laminating a flowable insulating film and removing film and circuit pattern from substrate
GB2049297A Method of manufacturing printed circuitry
US4159222A Method of manufacturing high density fine line printed circuitry