OSAKI ENGINEERING CO LTD has a total of 12 patent applications. Its first patent ever was published in 1993. It filed its patents most often in Japan, Republic of Korea and United States. Its main competitors in its focus markets audio-visual technology, machine tools and machines are FAR EAST MACHINERY CO LTD, JOSEPH T RYERSON AND SON and CHICAGO NIPPLE MFG COMPANY.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 10 | |
#2 | Republic of Korea | 1 | |
#3 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Machine tools | |
#3 | Machines | |
#4 | Civil engineering |
# | Technology | |
---|---|---|
#1 | Unspecified technologies | |
#2 | Finishing work on buildings | |
#3 | Accessories for machine tools | |
#4 | Casings and printed circuits |
# | Name | Total Patents |
---|---|---|
#1 | Okada Kaoru | 5 |
#2 | Morofuji Yoshitoshi | 2 |
#3 | Kobayashi Takeshi | 2 |
#4 | Morofuji Yoshihisa | 1 |
#5 | Yamauchi Masaru | 1 |
#6 | Kiso Shunsuke | 1 |
#7 | Tsukada Koichi | 1 |
#8 | Kobayashi Syoshi | 1 |
#9 | Oguchi Masao | 1 |
#10 | Matsukawa Shunei | 1 |
Publication | Filing date | Title |
---|---|---|
JP2009200296A | Transfer system of semiconductor chip | |
JP2008311329A | Pickup device | |
JP2008300437A | Pick-up apparatus and pick-up method | |
JP2007311470A | Apparatus and method of pressure-bonding | |
JP2006210504A | Method of connecting electronic device | |
JP2004006467A | Parts mounting apparatus of panel or substrate | |
JP2003282643A | Thermal compression bonding unit | |
JP2003066174A | Stage device | |
JP2002162670A | Illumination unit | |
JP2002165118A | Camera | |
KR20010001548A | Plasma display panel mounting device | |
US5441474A | PCB working machine and method |