WO03090933A2
|
|
Method and structures for improved assembly of mems devices employing a centrifuge
|
US6573156B1
|
|
Low defect method for die singulation and for structural support for handling thin film devices
|
WO0248023A2
|
|
Method for improving the polysilicon structures of a mems device by masking to inhibit anodic etching of the mems polysilicon structures
|
WO02056076A2
|
|
Fiber optic collimator array
|
US6571029B1
|
|
Method for determining and implementing electrical damping coefficients
|
US6556739B1
|
|
Electronic damping of MEMS devices using a look-up table
|
US6600850B1
|
|
MEMS optical switch with a notched latching apparatus for improved mirror positioning and method of fabrication thereof
|
US6567604B1
|
|
Indium plated package for an optical component and process therefore
|
US6556741B1
|
|
MEMS optical switch with torsional hinge and method of fabrication thereof
|
US6567574B1
|
|
Modular three-dimensional optical switch
|
US6445840B1
|
|
Micromachined optical switching devices
|
US6449406B1
|
|
Micromachined optomechanical switching devices
|
US6445841B1
|
|
Optomechanical matrix switches including collimator arrays
|
US6498870B1
|
|
Micromachined optomechanical switches
|