| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 4 | |
| #2 | China | 3 | |
| #3 | EPO (European Patent Office) | 2 | |
| #4 | Republic of Korea | 2 | |
| #5 | Malaysia | 1 | |
| #6 | Singapore | 1 | |
| #7 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Machines | |
| #3 | Audio-visual technology | |
| #4 | Semiconductors | |
| #5 | Chemical engineering | |
| #6 | Environmental technology | |
| #7 | Electrical machinery and energy |
| # | Name | Total Patents |
|---|---|---|
| #1 | Penik Stephen E Jr | 4 |
| #2 | Nye Aurora Marie Fojas | 3 |
| #3 | Du Jerry G | 3 |
| #4 | Andre Robert C | 3 |
| #5 | Bellemare Richard | 2 |
| #6 | Bernards Roger | 2 |
| #7 | Markowski Joachim | 2 |
| #8 | Martin James W | 1 |
| #9 | Trainor Jim | 1 |
| #10 | James W Martin | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW201504482A | Copper plating solutions and method of making and using such solutions | |
| TW201509245A | Process for forming self-assembled monolayer on metal surface and printed circuit board comprising self-assembled monolayer | |
| WO2012097037A2 | Electroless plating bath composition and method of plating particulate matter | |
| CN103282545A | Electroless nickel alloy plating bath and process for depositing thereof |