Learn more

OIZUMI SEISAKUSHO KK

Overview
  • Total Patents
    113
  • GoodIP Patent Rank
    201,831
About

OIZUMI SEISAKUSHO KK has a total of 113 patent applications. Its first patent ever was published in 1978. It filed its patents most often in Japan. Its main competitors in its focus markets measurement, electrical machinery and energy and audio-visual technology are SENSOTHERM TEMPERATURSENSORIK, ZITZMANN HEINRICH and NETSUSHIN KK.

Patent filings in countries

World map showing OIZUMI SEISAKUSHO KKs patent filings in countries
# Country Total Patents
#1 Japan 113

Patent filings per year

Chart showing OIZUMI SEISAKUSHO KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sato Tsutomu 11
#2 Sakurai Shuji 11
#3 Kaneko Hitoshi 10
#4 Yamamura Tomohiro 10
#5 Ota Tsuneo 9
#6 Sakagami Giichi 9
#7 Bando Shigeru 9
#8 Okada Masahisa 8
#9 Kurahara Toshifumi 7
#10 Saitou Kazumasa 7

Latest patents

Publication Filing date Title
JP2020106291A Temperature measuring instrument
JP2020021861A Temperature detector
JP2019132648A Temperature detector
JP2019132649A Temperature detector
JP2014016158A High-temperature heat-resistant temperature sensor
JP2010067739A Electrode for ntc thermistor, and method for manufacturing the same
JP2009270955A Glass sealing thermistor for temperature sensor
JP2009099662A High-temperature sensor
JP2009059756A High-temperature thermistor
JP2009059755A Electrode for ntc thermistor
JP2008112812A Method for insulating and isolating lead wire of thermistor
JP2008035797A Heat generation apparatus for liquid transpiration device
JP2007151488A Heater for liquid evaporator
JP2007141881A Electrode structure of thermistor
JP2007101334A Temperature sensor for hot water supply apparatus
JP2005277185A Method for manufacturing linearized thermistor
JP2005189080A Temperature sensor and its manufacturing method
JP2005098742A Catalytic combustion type hydrogen sensor
JP2005045175A Electronic component assembling method, and electronic component assembled thereby
JP2005002380A Method of applying nickel plating to electroconductive film on metallic oxide compacted sintered matter and nickel plating liquid composition for electrically conductive film