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NXP UNITED STATES INC

Overview
  • Total Patents
    53
  • GoodIP Patent Rank
    28,632
  • Filing trend
    ⇧ 166.0%
About

NXP UNITED STATES INC has a total of 53 patent applications. It increased the IP activity by 166.0%. Its first patent ever was published in 2013. It filed its patents most often in China. Its main competitors in its focus markets electrical machinery and energy, basic communication technologies and semiconductors are INTERSIL INC, MAXIM INTEGRATED PRODUCTS and NXP USA INC.

Patent filings in countries

World map showing NXP UNITED STATES INCs patent filings in countries
# Country Total Patents
#1 China 53

Patent filings per year

Chart showing NXP UNITED STATES INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Dechang 7
#2 Jiang Dengyu 5
#3 Huang Yan 4
#4 Wang Li 4
#5 Zhang Bin 4
#6 Chen Jianluo 3
#7 Tian Lei 3
#8 Mariano Layson Ching Jr 3
#9 Mao Huan 3
#10 Lai Mingguang 3

Latest patents

Publication Filing date Title
CN112216658A Semiconductor device having lead frame adaptable to various die sizes
CN112187051A Single inductor, multiple output, DC-DC converter
CN112151513A Power die package
CN112117815A Multi-coil wireless charger
CN110290611A The detector of heating electrical appliance
CN112003454A Bridgeless power factor correction converter with zero current detection circuit
CN111987815A Two-stage wireless power transmission system
CN111913898A PCIE root complex message interrupt generating method using end point
CN111767758A Finger vein recognition system
CN111752329A Reverse bias adjustment system and method for integrated circuits
CN111669152A Clock generator and method for generating clock signal
CN111666594A Time-based secure access control system
CN111668941A Overvoltage protection circuitry for wireless power receivers
CN111627485A Once readable memory and operation method thereof
CN111383686A Resistive memory device and method of operating a resistive memory device
CN111371437A Latching comparator circuit and method
CN111371189A Determining Q factor in wireless charging systems with complex resonant circuits
CN111370382A Hybrid lead frame for semiconductor die package with improved creepage distance
CN111341747A Lead shortening to improve creepage distance
CN111341748A Lead frame with selective pattern plating