| # | Technology | |
|---|---|---|
| #1 | Layered products | |
| #2 | Alloys | |
| #3 | Reduction of greenhouse gas emissions | |
| #4 | Semiconductor devices | |
| #5 | Batteries | |
| #6 | Non-metallic elements | |
| #7 | Metal tempering | |
| #8 | Chemical or physical processes | |
| #9 | Soldering, welding and flame cutting | |
| #10 | Inorganic compounds |
| # | Name | Total Patents |
|---|---|---|
| #1 | Uno Tomohiro | 6 |
| #2 | Sawaki Naoya | 5 |
| #3 | Unno Hiroto | 5 |
| #4 | Inaguma Toru | 4 |
| #5 | Sato Yutaka | 4 |
| #6 | Fujimoto Naoki | 4 |
| #7 | Oyamada Tetsuya | 3 |
| #8 | Nose Koichi | 3 |
| #9 | Terashima Shinichi | 3 |
| #10 | Fukuda Masahiro | 3 |
| Publication | Filing date | Title |
|---|---|---|
| TW201603220A | Bonding wire for semiconductor device | |
| TW201437010A | Steel-aluminum composite foil |