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NIPPON STEEL & SUMIKIN ELECTRONICS DEVICES INC

Overview
  • Total Patents
    40
About

NIPPON STEEL & SUMIKIN ELECTRONICS DEVICES INC has a total of 40 patent applications. Its first patent ever was published in 2011. It filed its patents most often in Japan, EPO (European Patent Office) and United States. Its main competitors in its focus markets semiconductors, materials and metallurgy and audio-visual technology are EVETTS J E, IXYS SEMICONDUCTOR GMBH and EVETTS JAN E.

Patent filings in countries

World map showing NIPPON STEEL & SUMIKIN ELECTRONICS DEVICES INCs patent filings in countries
# Country Total Patents
#1 Japan 38
#2 EPO (European Patent Office) 1
#3 United States 1

Patent filings per year

Chart showing NIPPON STEEL & SUMIKIN ELECTRONICS DEVICES INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kanehara Naoyuki 5
#2 Kamae Takayuki 5
#3 Matsunaga Hideki 5
#4 Fujita Sumio 3
#5 Hidaka Akihiro 3
#6 Eto Kentaro 3
#7 Tsuruta Yuki 2
#8 Nagahiro Masanori 2
#9 Okafuji Hideo 2
#10 Kosakata Akiyoshi 2

Latest patents

Publication Filing date Title
JP2015020102A Cleaning treatment apparatus
JP2015018884A Circuit board for housing semiconductor element
JP2015015266A Part transfer device
JP2015015513A Fpc board and connection method thereof, and package for housing electronic component
JP2015002307A Multiple piece wiring board
JP2014236176A Package for housing electronic component
JP2014227306A Brazing tool for ceramic package
JP2014211242A Reducing atmosphere burning jig
JP2014175557A Package for housing semiconductor imaging element
JP2014172100A Slit blade for forming pressing groove and manufacturing method for ceramic package
JP2014172101A Manufacturing method for ceramic package
JP2014154571A Power module substrate
JP2014150212A Package for housing electronic component
JP2014150209A Ceramic package and manufacturing method of the same
JP2014147945A Brazing material supply device
JP2014090048A Power module substrate
JP2014090049A Power module substrate
JP2014086581A Package for housing semiconductor element
JP2014072260A Method of manufacturing piezoelectric actuator
JP2014067922A Ceramic component and manufacturing method therefor