Method for producing polymerizable unsaturated group-containing alkali-soluble resin, polymerizable unsaturated group-contaning alkali-soluble resin, hydrogenated compound and method for producing the same, photosensitive resin composition, cured film obtained by curing the same, touch panel and color filter including the cured film as a component
TW202100650A
Resin composition, cured molded article, fiber-reinforced plastic molding material, fiber-reinforced plastic, fiber-reinforced plastic laminated molded body, and methods for producing same
TW202039608A
Photocurable silicone resin composition, silicone resin molded body obtained by curing same and method for manufacturing said molded body
TW202024600A
Silica spherical particles for semiconductor sealing material
TW202012502A
Polyimide precursor, polyimide produced from same, and flexible device
TW202021001A
Cu alloy bonding wire for semiconductor device
TW201942176A
Epoxy resin modified with polyurethane in low concentration, production method therefor, epoxy resin composition, and cured object
TW201942326A
Material for organic electroluminescence element, and organic electroluminescence element
TW201946309A
Polymer for organic electroluminescent element and organic electroluminescent element
TW201918375A
Metal-clad laminate and circuit board of which the insulating resin layer is excellent in dimensional stability even in the high temperature and the high pressure environments, or the environment with varying humidity
TW202010634A
Laminated board with metal-coated layer, adhesive sheet, adhesive polyimide resin composition and circuit substrate having adhesive layer with excellent adhesion, dielectric constant, small dielectric dissipation factor and capable of reducing transmission loss even for high-frequency transmission
SG11202001066VA
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
SG11201909287YA
Spherical crystalline silica particles and method for producing same
TW201736413A
Soluble polyfunctional vinyl aromatic copolymer, its production method, hardenable composition and its application
