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NIPPON FOIL MFG

Overview
  • Total Patents
    457
About

NIPPON FOIL MFG has a total of 457 patent applications. Its first patent ever was published in 1976. It filed its patents most often in Japan, Germany and United Kingdom. Its main competitors in its focus markets environmental technology, textiles and paper and audio-visual technology are SH COPPER PRODUCTS CORP, KAWAGUCHI TORANOSUKE and FUJI FILM SELLTEC KK.

Patent filings per year

Chart showing NIPPON FOIL MFGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yokota Yuzo 113
#2 Yamamoto Kaneshige 82
#3 Saito Toshio 47
#4 Kitamura Hironori 45
#5 Wasamoto Mitsuyuki 39
#6 Noma Kanji 28
#7 Sasada Eiji 25
#8 Kataoka Tsugio 25
#9 Araki Keiichi 24
#10 Kamigaichi Masayuki 24

Latest patents

Publication Filing date Title
JP2014007534A Printed matter in which dot pattern is printed
JP2014005022A Press through pack
JP2013256083A Cover of chucking cone
JP2013026063A Positive electrode for secondary battery with current collector made of aluminum alloy, and manufacturing method of positive electrode for secondary battery
JP2011114107A Method for manufacturing flexible printed circuit board
JP2011074433A Aluminum alloy foil for lithium ion secondary battery, and method for producing the same
JP2011026656A Aluminum alloy foil for lithium ion secondary battery and method for producing the same
JP2011023548A Gravure printing cylinder, method for printing etching resist using the same, and method for manufacturing printed wiring board
JP2009234665A Method for deep-drawing packing material
JP2010236055A Aluminum alloy foil for lithium ion secondary battery, and method for producing the same
JP2010137413A Gravure plate cylinder and gravure printing method using the same
JP2010095303A Simple container for food housing
JP2010067356A Sheet for electromagnetic induction heating cooker
JP2009287878A Filter cover for range hood
JP2009034739A Entry sheet to be used in drilling
JP2007308805A Aluminum alloy foil and its manufacturing method
JP2009001291A Lid material and package
JP2008298396A Cover device for vent hole
JP2008239201A Packaging material
JP2008214647A Method for manufacturing printed circuit board