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NINGBO JIANGFENG ELECTRONIC MATERIAL CO LTD

Overview
  • Total Patents
    30
About

NINGBO JIANGFENG ELECTRONIC MATERIAL CO LTD has a total of 30 patent applications. Its first patent ever was published in 2009. It filed its patents most often in China. Its main competitors in its focus markets surface technology and coating, machine tools and materials and metallurgy are HEFEI JIANGFENG ELECTRONIC MAT CO LTD, ARAKAWA KAKO KK and TAIHEI KINZOKU KOGYO KK.

Patent filings in countries

World map showing NINGBO JIANGFENG ELECTRONIC MATERIAL CO LTDs patent filings in countries
# Country Total Patents
#1 China 30

Patent filings per year

Chart showing NINGBO JIANGFENG ELECTRONIC MATERIAL CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Xueze 17
#2 Yao Lijun 17
#3 Pan Jie 17
#4 Lijun Yao 13
#5 Xueze Wang 13
#6 Kazuhiko Oiwa 12
#7 Toshio Aihara 12
#8 Jie Pan 10
#9 Qing Liu 6
#10 Yongjun Chen 3

Latest patents

Publication Filing date Title
CN104419907A Target material component and formation method thereof
CN104416307A Heating plate for welding bench, manufacturing method of welding bench and welding bench
CN104419902A Target treatment method
CN104416253A Backboard forming method and backboard
CN104422611A Metallurgical corrosive and metallurgical structure display method
CN104419901A Method for manufacturing tantalum target material
CN104416281A Target assembly and manufacturing method thereof
CN104419900A Sputtering target material and manufacturing method thereof
CN104419899A Forming method for target material
CN104418595A Sialon ceramic target material production method
CN104416325A Manufacturing method of tungsten target
CN104209864A Polishing pad finisher, polishing pad finishing device and polishing system
CN104209863A Polishing pad finisher, manufacturing method of polishing pad finisher, polishing pad finishing device and polishing system
CN104213083A Manufacture method of tungsten-titanium target material
CN104128740A Preparation method of copper target
CN102059582A Method for processing molybdenum target material
CN102059421A Ti target material and Al backboard welding method
CN102059519A Method for preparing back plate and back plate structure
CN102051506A Aluminum alloy material and preparation method of aluminum alloy backboard for LED (Light-Emitting Diode) chip
CN102062366A Backboard for LED (light-emitting diode) chip and preparation method of material of backboard for LED (light-emitting diode) chip