| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 5 | |
| #2 | United States | 4 | |
| #3 | Japan | 3 | |
| #4 | China | 1 |
| # | Industry | |
|---|---|---|
| #1 | Consumer goods | |
| #2 | Textiles and paper | |
| #3 | Macromolecular chemistry and polymers | |
| #4 | Machines | |
| #5 | Surface technology and coating |
| # | Technology | |
|---|---|---|
| #1 | Footwear features | |
| #2 | Artificial filament production devices | |
| #3 | Hats | |
| #4 | Macromolecular compounds compositions | |
| #5 | Compounding processes | |
| #6 | Special textiles | |
| #7 | Producing goods from plastic | |
| #8 | Compounding ingredients | |
| #9 | Layered products | |
| #10 | Hats |
| # | Name | Total Patents |
|---|---|---|
| #1 | Jeong Sang-Ok | 6 |
| #2 | Jeong Sang Ok | 4 |
| #3 | Jeong Sangok | 3 |
| #4 | Lee Hak Woo | 2 |
| #5 | Park Sung Young | 2 |
| #6 | Han Dong Hun | 2 |
| #7 | Lee Dan Bi | 2 |
| #8 | Park Sang Young | 1 |
| #9 | Kim Yan Wook | 1 |
| #10 | Kim Sang-Jun | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2020046071A1 | Shoe | |
| US2017055638A1 | Adhesive bonding of a shoe sole |