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MULTI PLANAR TECHNOLOGIES INC

Overview
  • Total Patents
    27
About

MULTI PLANAR TECHNOLOGIES INC has a total of 27 patent applications. Its first patent ever was published in 2000. It filed its patents most often in United States, Taiwan and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets machine tools are KHALIMULIN RAID M, KUNSHAN QISHENG GRINDING MATERIALS AND GRINDING TOOL CO LTD and TSCHUDIN URS.

Patent filings per year

Chart showing MULTI PLANAR TECHNOLOGIES INCs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Machine tools

Focus technologies

Top inventors

# Name Total Patents
#1 Kajiwara Jiro 24
#2 Moloney Gerard S 20
#3 Wang Huey-Ming 18
#4 Hansen David A 16
#5 Reyes Alejandro 13
#6 Yang Junsheng 5
#7 Moloney Gerard 3
#8 Liu Jun 3
#9 Walsh Cormac 3
#10 Saldana Ernesto 3

Latest patents

Publication Filing date Title
TW200402348A Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
US6887132B2 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
WO02078899A1 Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal
TWI246448B Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
US2002182867A1 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
AU5974501A System and method for pneumatic diaphragm cmp head having separate retaining ring and multi-region wafer pressure control
US6623343B2 System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US6540590B1 Chemical mechanical polishing apparatus and method having a rotating retaining ring
US6527625B1 Chemical mechanical polishing apparatus and method having a soft backed polishing head
US6558232B1 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6506105B1 System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control