| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 4 | |
| #2 | Republic of Korea | 3 | |
| #3 | Singapore | 2 | |
| #4 | WIPO (World Intellectual Property Organization) | 2 | |
| #5 | Japan | 1 | |
| #6 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Audio-visual technology | |
| #3 | Semiconductors | |
| #4 | Materials and metallurgy | |
| #5 | Environmental technology | |
| #6 | Machines |
| # | Name | Total Patents |
|---|---|---|
| #1 | Xu Xingling | 6 |
| #2 | Kondo Muneharu | 4 |
| #3 | Webb Eric | 4 |
| #4 | Blanchard James D | 3 |
| #5 | Dubin Valery M | 3 |
| #6 | Tao Yingxiang | 2 |
| #7 | Shimizu Shumpei | 1 |
| #8 | Shimizu Shunpei | 1 |
| Publication | Filing date | Title |
|---|---|---|
| SG11201502957WA | Improvements in plating bath metrology | |
| KR20120030399A | High speed copper plating bath | |
| KR20100061464A | Electroplating aqueous solution and method of making and using same | |
| US2009090631A1 | Substrate holder and electroplating system | |
| JPS63107809A | Manufacture of high purity silica |