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MORI YASUHIRO

Overview
  • Total Patents
    69
  • GoodIP Patent Rank
    203,769
About

MORI YASUHIRO has a total of 69 patent applications. Its first patent ever was published in 1984. It filed its patents most often in Japan, United States and Republic of Korea. Its main competitors in its focus markets machines, surface technology and coating and audio-visual technology are GURIT WORBLA AG, MORO TOSHIO and MAFO SYSTEMTECH GMBH & CO KG.

Patent filings per year

Chart showing MORI YASUHIROs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Mori Yasuhiro 69
#2 Detzner Peter 6
#3 Yamashita Mikio 3
#4 Nakamoto Eiji 1
#5 Yuki Tsuneaki 1
#6 Yamanaka Mutsuhiro 1
#7 Takenouchi Toshiharu 1
#8 Kawahara Hideki 1
#9 Uchiyama Hisakazu 1
#10 Watanabe Hiroyuki 1

Latest patents

Publication Filing date Title
JP2020063054A Pipe packing system
JP2017193903A Crack-inducing joint sealant
JP2017124492A Protective cap for steel pipe material or the like and method for producing the same
JP2015221971A Crack-inducing joint sealant
KR20090077372A High close adhesion coating method for metal alloy and metal alloy coated by the same
KR20090055052A Insert molding method for a composite of different kinds of materials and a composite manufactured by the same
JP2009051190A Different material composite molding method based on insert molding technique, and different material composite molded object molded by the method
JP2008192394A Method of manufacturing electric wire
JP2008189742A Method for treating surface of recycled material
US2008182942A1 Method for modifying of composite resin
TW200831578A Method for modifying of composite resin
KR100818036B1 Method for modifying of composite resin
CA2574725A1 Method for modifying composite resin
JP2008119675A Method for coating substrate of poor cohesiveness and poor adhesiveness with water-based coating material comprising polyurethane resin, and substrate of poor cohesiveness and poor adhesiveness coated by this method
JP2008088391A Method for forming electrical wiring or electronic circuit using digital printing technique based on digital information, and electrical wiring or electronic circuit obtained using the method
JP2007002264A Surface modifying method for solid substance and surface-modified solid substance
WO2007015498A1 Surface modification process
JP2008037078A Different material composite molding method based on insert mold technique and different material composite molded object molded by the method
JP2007307882A Method for decorating various adherends according to technique on transfer foil etc. and decoration configuration based on this technique
JP2007247051A High-adhesion coating method to metal-alloy molded object and metal-alloy molded object subjected to high-adhesion coating by the method