| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 27 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Packaging and shipping | |
| #3 | Machine tools | |
| #4 | Environmental technology | |
| #5 | Optics | |
| #6 | Semiconductors |
| # | Name | Total Patents |
|---|---|---|
| #1 | Haruo Wakayama | 2 |
| #2 | Inoue Shuichi | 1 |
| #3 | Kondou Mikio | 1 |
| #4 | Maekawa Kazuya | 1 |
| #5 | Soyama Hiroshi | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW200640603A | Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same |