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MITSUBISHI PENCIL COMPANY LIMITED

Overview
  • Total Patents
    37
  • GoodIP Patent Rank
    55,232
  • Filing trend
    ⇩ 33.0%
About

MITSUBISHI PENCIL COMPANY LIMITED has a total of 37 patent applications. It decreased the IP activity by 33.0%. Its first patent ever was published in 2010. It filed its patents most often in Taiwan, Australia and Singapore. Its main competitors in its focus markets basic materials chemistry, consumer goods and macromolecular chemistry and polymers are KOH I NOOR HARDTMUTH, STAEDTLER FA J S and JS STAEDTLER GMBH & CO KG.

Patent filings in countries

World map showing MITSUBISHI PENCIL COMPANY LIMITEDs patent filings in countries
# Country Total Patents
#1 Taiwan 33
#2 Australia 3
#3 Singapore 1

Patent filings per year

Chart showing MITSUBISHI PENCIL COMPANY LIMITEDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sato Atsushi 7
#2 Abe Hiroshi 7
#3 Suzuki Takanori 6
#4 Maruyama Seiichi 4
#5 Sakagami Masashi 4
#6 Takigawa Seiichi 4
#7 Ogura Kousuke 4
#8 Nakamura Hitoshi 3
#9 Shinmura Yukako 3
#10 Hirayama Akiko 3

Latest patents

Publication Filing date Title
TW201835201A Nonaqueous dispersion of fluorine-based resin heat cure resin composition containing fluorine-based resin using the same and the cured product thereof polyimide precursor solution composition
TW201815905A Nonaqueous dispersion of fluorine-based resin heat cure resin composition containing fluorine-based resin using the same and the cured product thereof polyimide precursor solution composition
TW201729715A Applicator capable of easily fixing an application body and securing a flow path of a coating liquid
TW201723062A Nonaqueous dispersion containing fluorine-based resin, thermosetting resin composition containing fluorine-based resin and its cured product, and adhesive composition for circuit boards characterized by having properties of excellent adhesion, heat-resistance, and low viscosity
TW201641565A Polytetrafluoroethylene oily solvent-based dispersion, polytetrafluoroethylene-containing epoxy resin composition, and hardened product thereof
TW201702765A Pattern structure comprising a substrate and a pattern film
TW201438930A Clamping body and mechanical pencil