Learn more

MITSUBISHI KASEI POLYTEC CO

Overview
  • Total Patents
    124
About

MITSUBISHI KASEI POLYTEC CO has a total of 124 patent applications. Its first patent ever was published in 1983. It filed its patents most often in Japan, United States and EPO (European Patent Office). Its main competitors in its focus markets machines, environmental technology and macromolecular chemistry and polymers are ASAHI RUBBER INC, MITSUBISHI MONSANTO CHEM and SUMITOMO BAKELITE CO.

Patent filings per year

Chart showing MITSUBISHI KASEI POLYTEC COs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Miyashita Kazuhisa 19
#2 Yoshida Shigenobu 16
#3 Ohashi Shinichi 14
#4 Hasegawa Masashi 13
#5 Sawada Tsutomu 9
#6 Mori Kenji 8
#7 Akiyama Naoki 8
#8 Orito Fumio 7
#9 Isekawa Hiroshi 7
#10 Goto Akiko 6

Latest patents

Publication Filing date Title
US5445897A Epitaxial wafer and process for producing the same
JPH05310863A Aromatic vinyl resin composition
JPH05193081A Polyamide base laminated biaxially stretched film
JPH06297470A Resin composition for purging molding machine
JPH065923A Forced cooling light emitting diode device
JPH05343740A Gallium arsenide phosphide epitaxial wafer
JPH05315210A Gallium arsenide phosphide mixed-crystal epitaxial wafer
JPH05310864A Production of heat-resistant styrene resin composition
JPH05305646A Manufacture of thin thermoplastic synthetic resin film
JPH05295051A Rubber-reinforced resin composition and its production
JPH05247316A Flame retardant rubber-reinforced styrenic resin composition
JPH05239161A Aromatic vinylic resin composition
JPH05239160A Aromatic vinylic resin composition
AU646331B2 Biaxially oriented polyamide laminate film
JPH05194674A Impact resistant polystyrene-based resin composition
JPH0557855A Heat-shrinkable laminated film for heat-seal
JPH0564868A Heat-sealable laminated film having high dimensional stability
JPH05179095A Styrenic resin composition
JPH0577373A Polyamide type laminated biaxially stretched film
JPH05160226A Single crystalline semiconductor substrate