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MIMASU SEMICONDUCTOR IND CO

Overview
  • Total Patents
    89
  • GoodIP Patent Rank
    232,963
About

MIMASU SEMICONDUCTOR IND CO has a total of 89 patent applications. Its first patent ever was published in 1984. It filed its patents most often in Japan, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, environmental technology and surface technology and coating are NAKATA JOSUKE, JOSUKE NAKATA and IQE SILICON COMPOUNDS LTD.

Patent filings per year

Chart showing MIMASU SEMICONDUCTOR IND COs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tsuchiya Masato 59
#2 Mashimo Ikuo 20
#3 Ogasawara Syunichi 17
#4 Ogasawara Shunichi 15
#5 Kimura Yoshimichi 14
#6 Maruyama Fumiaki 9
#7 Saito Koichi 9
#8 Murooka Hideyuki 9
#9 Tomaru Shinichi 7
#10 Yamazaki Tetsuo 5

Latest patents

Publication Filing date Title
JP2015233059A Submerged wafer isolation method and submerged wafer isolation device
JP2011124481A Method and device for isolation of submerged wafer
WO2009072438A1 Process for producing polycrystalline silicon substrate and polycrystalline silicon substrate
JP2009179912A Dustproof garment with aspirator
JP2009168068A Rotary joint
US2009266414A1 Process for producing semiconductor substrate, semiconductor substrate for solar application and etching solution
JP2010045057A Submerged wafer separating method, and submerged wafer separating apparatus
JP2006346808A Grinding pad sticking method and workpiece producing method
US2009032498A1 Spin Processing Method And Apparatus
WO2006059382A1 Surface treating apparatus for square wafer for solar battery
WO2006051585A1 Single-wafer processor
KR20070094674A Single wafer processing apparatus
JP2006114643A Chuck for wafer
EP1729332A1 Schedule control method in spin etching
JP2005135936A Wafer-chamfering method and wafer
WO2005036629A1 Process for roughening surface of wafer
JP2005105068A Lapping slurry and method for processing wafer
JP2005103684A Colloidal dispersion type lapping compound and its manufacturing method
JP2005093869A Method of regenerating silicon wafer, and regenerated wafer
CN1695241A Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine