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MCAVOY GREGORY JOHN

Overview
  • Total Patents
    38
  • GoodIP Patent Rank
    210,596
  • Filing trend
    ⇩ 100.0%
About

MCAVOY GREGORY JOHN has a total of 38 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2008. It filed its patents most often in United States, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets textiles and paper, machines and engines, pumps and turbines are JACOB FELBEL, ALEXANDER T BROWN and ROSATI ROBERT.

Patent filings in countries

World map showing MCAVOY GREGORY JOHNs patent filings in countries

Patent filings per year

Chart showing MCAVOY GREGORY JOHNs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Mcavoy Gregory John 38
#2 Silverbrook Kia 23
#3 O'Reilly Ronan Padraig Sean 19
#4 Kerr Emma Rose 13
#5 Lawlor Vincent Patrick 13
#6 Bagnat Misty 10
#7 Johnstone David Mcleod 8
#8 Worsman Matthew Taylor 1
#9 Hogan Julie Catherine 1
#10 O'Reilly Rónán Pádraig Seán 1

Latest patents

Publication Filing date Title
EP3515712A1 Droplet ejector
US2012081465A1 Inkjet printhead with join regions seamlessly compensated by directional nozzles
US2012081463A1 Inkjet nozzle assembly with drop directionality control via independently actuable roof paddles
US2012081432A1 Stationary inkjet printhead with dead nozzle compensation provided by nozzles in same nozzles row
US2012081464A1 Pagewidth inkjet printhead with drop directionality control
US2012081435A1 Method of compensating for dead nozzles in stationary pagewidth printhead
US2012081429A1 Method of printing at dot density exceeding nozzle density in stationary pagewidth printhead
US2012081469A1 Pagewidth inkjet printhead configured such that printed dot density exceeds nozzle density
US2012081467A1 Inkjet printhead having common conductive track on nozzle plate
US2011050806A1 Crack-resistant thermal bend actuator
US2011047781A1 Method of fabricating crack-resistant thermal bend actuator
US2011018941A1 Printhead integrated comprising through-silicon connectors
US2011018940A1 Printhead integrated circuit configured for backside electrical connection
US2011018939A1 Inkjet printhead assembly having backside electrical connection
US2011020965A1 Method of fabricating printhead integrated circuit with backside electrical connections
US2011020964A1 Method of fabricating inkjet printhead assembly having backside electrical connections
US2011018936A1 Printhead having polymer incorporating nanoparticles coated on ink ejection face
US2009317272A1 MEMS integrated circuit comprising peristaltic microfluidic pump
US2009314972A1 Mechanically-actuated microfluidic diaphragm valve
US2009314365A1 MEMS integrated circuit comprising microfluidic diaphragm valve