| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Republic of Korea | 6 | |
| #2 | Taiwan | 6 | |
| #3 | China | 5 | |
| #4 | WIPO (World Intellectual Property Organization) | 5 | |
| #5 | United States | 2 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Semiconductors | |
| #3 | Surface technology and coating | |
| #4 | Textiles and paper |
| # | Technology | |
|---|---|---|
| #1 | Grinding or polishing devices | |
| #2 | Semiconductor devices | |
| #3 | Layered products | |
| #4 | Grinding tools | |
| #5 | Woven fabrics |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yajima Toshiyasu | 23 |
| #2 | Ninomiya Daisuke | 22 |
| #3 | Tatsuno Shimpei | 2 |
| #4 | Iida Matsuo | 2 |
| #5 | Toshiyasu Yajima | 1 |
| #6 | Kato Shinya | 1 |
| #7 | Goto Yukio | 1 |
| #8 | Watanabe Tetsuya | 1 |
| #9 | Katayama Takashi | 1 |
| #10 | Daisuke Ninomiya | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2020189233A1 | Surface plate for polishing device, and polishing device and polishing method |