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LIYANG DONGDA TECHNOLOGY TRANSFER CT CO LTD

Overview
  • Total Patents
    40
About

LIYANG DONGDA TECHNOLOGY TRANSFER CT CO LTD has a total of 40 patent applications. Its first patent ever was published in 2013. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, environmental technology and electrical machinery and energy are PARK JEA GUN, RAMANATHAN SHRIRAM and ADVANCED SILICON GROUP INC.

Patent filings in countries

World map showing LIYANG DONGDA TECHNOLOGY TRANSFER CT CO LTDs patent filings in countries
# Country Total Patents
#1 China 40

Patent filings per year

Chart showing LIYANG DONGDA TECHNOLOGY TRANSFER CT CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Cong Guofang 40

Latest patents

Publication Filing date Title
CN103606390A Leadless-silver-conductor slurry
CN103762305A Manufacturing method for piezoelectric element containing La203 stress buffer body
CN103606632A Polymer light-emitting diode
CN103602966A Amorphous zinc oxide/titanium/phosphorus composite material manufacturing method
CN103602145A Nanometer silver ink for printed circuit
CN103607856A Manufacturing method for composite flexible printed circuit board
CN103606631A Polymer light emitting diode having hole transport layer
CN103606419A Preparation method for leadless-silver-conductor slurry
CN103606611A Vertical light emitting diode with high light extraction efficiency
CN103762303A Piezoelectric element containing BaO stress buffer body
CN103606612A Electrode structure of light-emitting diode
CN103606629A Polymer light emitting diode including electron transport layer
CN103762304A Piezoelectric element containing Sc203 stress buffer bodies
CN103602929A Magnesium-base amorphous alloy composite material preparation method
CN103606623A Method for manufacturing piezoelectric element comprising SrO stress buffer bodies
CN103607839A Composite flexible substrate
CN103607855A Method for manufacturing composite flexible printed circuit board
CN103606569A Photovoltaic cell structure
CN103607846A Manufacturing method for flexible printed circuit board
CN103700764A Method for manufacturing piezoelectric element comprising HfO2 stress buffer body