LEE CHUNG J has a total of 14 patent applications. Its first patent ever was published in 1988. It filed its patents most often in Canada and United States. Its main competitors in its focus markets macromolecular chemistry and polymers, machines and surface technology and coating are DIELECTRIC SYSTEMS INC, KASHIWAGI TSUTOMU and DOW GLOBAL TECHNOLOGIES.
# | Country | Total Patents | |
---|---|---|---|
#1 | Canada | 7 | |
#2 | United States | 7 |
# | Industry | |
---|---|---|
#1 | Macromolecular chemistry and polymers | |
#2 | Machines | |
#3 | Surface technology and coating | |
#4 | Semiconductors | |
#5 | Chemical engineering | |
#6 | Thermal processes |
# | Name | Total Patents |
---|---|---|
#1 | Lee Chung J | 14 |
#2 | Kumar Atul | 7 |
#3 | Chen Chieh | 3 |
#4 | Tzeng George | 2 |
#5 | Nguyen Oanh | 2 |
#6 | Liu Chang Y | 1 |
#7 | Solomensky Michael | 1 |
Publication | Filing date | Title |
---|---|---|
US2007119369A1 | Method for producing reactive intermediates for transport polymerization | |
US2006274474A1 | Substrate Holder | |
US2006275547A1 | Vapor Phase Deposition System and Method | |
US2006201426A1 | Reactor for Producing Reactive Intermediates for Transport Polymerization | |
US2005274322A1 | Reactor for producing reactive intermediates for low dielectric constant polymer thin films | |
US2006046044A1 | Porous composite polymer dielectric film | |
CA1299801C | Soluble polyimidesiloxanes and methods for their preparation and use |