LEE BYOUNG HWA has a total of 17 patent applications. Its first patent ever was published in 2008. It filed its patents most often in United States and Republic of Korea. Its main competitors in its focus markets electrical machinery and energy, chemical engineering and textiles and paper are VISHAY ISRAEL LTD, KCK CO LTD and PRESIDIO COMPONENTS INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 12 | |
#2 | Republic of Korea | 5 |
# | Industry | |
---|---|---|
#1 | Electrical machinery and energy | |
#2 | Chemical engineering | |
#3 | Textiles and paper | |
#4 | Audio-visual technology | |
#5 | Semiconductors | |
#6 | Environmental technology | |
#7 | IT methods for management | |
#8 | Machines |
# | Name | Total Patents |
---|---|---|
#1 | Lee Byoung Hwa | 17 |
#2 | Park Min Cheol | 12 |
#3 | Park Sang Soo | 11 |
#4 | Park Dong Seok | 11 |
#5 | Wi Sung Kwon | 11 |
#6 | Chung Hae Suk | 9 |
#7 | Cho Hong Yeon | 2 |
#8 | Kwak Ho Cheol | 1 |
#9 | Ke Haixin | 1 |
#10 | Hubing Todd Harvey | 1 |
Publication | Filing date | Title |
---|---|---|
KR20210003371A | Apparatus and method for metalic fabric | |
KR20210002792A | Apparatus and method for foil and metalic fabric | |
KR20200096003A | A manufacturing method of burn-out dyed fabric | |
KR20190138173A | Fabric comprising after-treadted flocking, metalic, foil and method thereof | |
KR20190122990A | Fabric comprising after-treadted flocking, metalic, foil and method thereof | |
US2010117192A1 | Semiconductor integrated circuit chip, multilayer chip capacitor and semiconductor integrated circuit chip package | |
US2009244807A1 | Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network |