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LEARONAL INC

Overview
  • Total Patents
    115
About

LEARONAL INC has a total of 115 patent applications. Its first patent ever was published in 1978. It filed its patents most often in United States, EPO (European Patent Office) and Japan. Its main competitors in its focus markets surface technology and coating, audio-visual technology and chemical engineering are TDAO LTD, GALENTAN AG and HUEBEL EGON.

Patent filings per year

Chart showing LEARONAL INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Nobel Fred I 34
#2 Brasch William R 20
#3 Toben Michael P 19
#4 Martin James L 12
#5 Brown Neil D 12
#6 Thomson Donald 11
#7 Schram David N 11
#8 Brasch William 9
#9 Esterl David J 7
#10 Schetty Robert A 7

Latest patents

Publication Filing date Title
US6210556B1 Electrolyte and tin-silver electroplating process
WO9823444A1 Lead-free deposits for bearing surfaces
US6071398A Programmed pulse electroplating process
US5897848A Process for producing hypophosphite compounds
US5750018A Cyanide-free monovalent copper electroplating solutions
US5578182A Electrolytic production of hypophosphorous acid
EP0697805A1 Printed circuit board manufacture utilizing electroless palladium
US5492615A Cyclodextrin stabilization of organic metal finishing additives in aqueous metal treating baths
US5480517A Electrolytic production of hypophosphorous acid
US5522972A Nickel hypophosphite manufacture
US5427677A Flux for reflowing tinplate
US5312539A Electrolytic tin plating method
US5378347A Reducing tin sludge in acid tin plating
US5302278A Cyanide-free plating solutions for monovalent metals
US5256275A Electroplated gold-copper-silver alloys
EP0467199A2 Preparation of printed circuit boards by metallization
US5106473A Process for metallizing a through-hole board
US5085744A Electroplated gold-copper-zinc alloys
US5066367A Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726A Limiting tin sludge formation in tin or tin-lead electroplating solutions