LASERTEC GMBH has a total of 12 patent applications. Its first patent ever was published in 1998. It filed its patents most often in Germany, United States and EPO (European Patent Office). Its main competitors in its focus markets machine tools and measurement are GEN LASERTRONICS CORP, HAN KWANG CO LTD and XIAN MICROMACH PHOTON TECH CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Germany | 5 | |
#2 | United States | 3 | |
#3 | EPO (European Patent Office) | 2 | |
#4 | WIPO (World Intellectual Property Organization) | 2 |
# | Industry | |
---|---|---|
#1 | Machine tools | |
#2 | Measurement |
# | Technology | |
---|---|---|
#1 | Soldering, welding and flame cutting | |
#2 | Measuring length, angles and areas | |
#3 | Blasting |
# | Name | Total Patents |
---|---|---|
#1 | Hildebrand Peter | 12 |
#2 | Kuhl Michael | 12 |
#3 | Reisacher Martin | 12 |
#4 | Wrba Peter | 5 |
#5 | Reinicke Gottfried | 2 |
#6 | Eiterer Alfons | 2 |
#7 | Stürmer Udo | 1 |
#8 | Stuermer Udo | 1 |
#9 | Schoene Wolfram | 1 |
Publication | Filing date | Title |
---|---|---|
US2005029237A1 | Depth measurement and depth control or automatic depth control for a hollow to be produced by a laser processing device | |
DE102004013475A1 | Method and device for removing material | |
DE10352402A1 | Laser processing machine and laser processing method | |
DE10324439A1 | Method and device for producing a die | |
DE10317579A1 | Method and device for producing a die in a workpiece | |
DE10317322A1 | Method and device for determining the removal rate of a laser beam and for producing a die in a workpiece | |
EP1117974A1 | Laser processing device with layer by layer removal with die depth storage for future control | |
EP1117503A1 | Method and device for removing material from a surface of a work piece |