LASER ENG APPLICATIONS has a total of 36 patent applications. It increased the IP activity by 175.0%. Its first patent ever was published in 2016. It filed its patents most often in WIPO (World Intellectual Property Organization), EPO (European Patent Office) and United States. Its main competitors in its focus markets machine tools, optics and computer technology are BIAS FORSCHUNG & ENTWICKLUNG, WUHAN LINGYUN PHOTOELECTRONIC SYSTEM CO LTD and SHENZHEN MICROMACH TECH CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 9 | |
#2 | EPO (European Patent Office) | 8 | |
#3 | United States | 7 | |
#4 | Belgium | 6 | |
#5 | China | 3 | |
#6 | Republic of Korea | 2 | |
#7 | Hong Kong | 1 |
# | Industry | |
---|---|---|
#1 | Machine tools | |
#2 | Optics | |
#3 | Computer technology | |
#4 | Control | |
#5 | Machines | |
#6 | Measurement | |
#7 | Materials and metallurgy |
# | Name | Total Patents |
---|---|---|
#1 | Kupisiewicz Axel | 26 |
#2 | Martin Paul-Etienne | 23 |
#3 | Henrottin Anne | 12 |
#4 | Estival Sébastien | 12 |
#5 | Bruneel David | 11 |
#6 | Cangueiro Liliana | 8 |
#7 | Ramos De Campos Jose-Antonio | 7 |
#8 | Ramos De Campos Jose Antonio | 7 |
#9 | Ramos De Campos Jose | 6 |
#10 | Estival Sebastien | 5 |
Publication | Filing date | Title |
---|---|---|
BE1027475B1 | Bulk heat treatment process and associated system | |
US2021024411A1 | Method for structuring a transparent substrate with a laser in a burst mode | |
BE1026484A1 | Optical method and device for providing two offset laser beams | |
BE1026479A1 | System and method for holding in position for machining and / or welding by laser radiation | |
CN110891730A | Method for building a substrate, assembly comprising a substrate and a device for building said substrate, and substrate having such a structure | |
BE1026360A1 | Dust management method and system for laser machining | |
BE1026154A1 | Optical system | |
BE1025957A1 | Method for determining laser machining parameters and laser machining device using said method | |
CN109414789A | The method for engaging substrate with component by the structuring of substrate | |
KR20180048670A | Processing device |