| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Republic of Korea | 5 | |
| #2 | United States | 5 | |
| #3 | WIPO (World Intellectual Property Organization) | 5 | |
| #4 | EPO (European Patent Office) | 3 | |
| #5 | China | 2 | |
| #6 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Semiconductors | |
| #3 | Environmental technology | |
| #4 | Electrical machinery and energy | |
| #5 | Materials and metallurgy | |
| #6 | Optics | |
| #7 | Packaging and shipping | |
| #8 | Machines |
| # | Name | Total Patents |
|---|---|---|
| #1 | Matsumoto Yoshiie | 21 |
| #2 | Suga Tadatomo | 13 |
| Publication | Filing date | Title |
|---|---|---|
| KR20170034386A | Thin substrate, method for manufacturing same, and method for transporting substrate | |
| US2015171365A1 | Electronic element sealing method and bonded substrate | |
| WO2007108364A1 | Thin film forming device and thin film forming method |