| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 6 | |
| #2 | Taiwan | 4 | |
| #3 | China | 3 | |
| #4 | Japan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Electrical machinery and energy | |
| #2 | Semiconductors | |
| #3 | Thermal processes | |
| #4 | Machines |
| # | Name | Total Patents |
|---|---|---|
| #1 | Lin Hsuan-Chih | 4 |
| #2 | Chen Hong-Long | 4 |
| #3 | Xuanzhi Lin | 3 |
| #4 | Lin Hsuan Chih | 3 |
| #5 | Henglong Chen | 2 |
| #6 | Chen Hong Long | 2 |
| #7 | Hsu Ting-Wei | 1 |
| #8 | Teng Chia-Ru | 1 |
| #9 | Chen Yi-Fu | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2010270922A1 | LED heat sink module, LED module for LED heat sink module | |
| CN101943378A | Packing device | |
| CN101943379A | Switching module | |
| CN101930932A | LED light-emitting module processing method | |
| TW201100700A | Transfer module | |
| TW201100697A | Force the device | |
| TW201044642A | LED luminous module process method | |
| US2010032136A1 | Cooler module | |
| US2008035311A1 | Cooler system | |
| US7104311B1 | Heat sink assembly | |
| TW200418359A | Manufacturing method of heat sink and its structure |