KSW MICROTEC AG has a total of 23 patent applications. Its first patent ever was published in 1999. It filed its patents most often in WIPO (World Intellectual Property Organization), EPO (European Patent Office) and Germany. Its main competitors in its focus markets computer technology, telecommunications and audio-visual technology are Féinics Amatech Teoranta, ASK SA and CUBIT ELECTRONICS GMBH.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 6 | |
#2 | EPO (European Patent Office) | 4 | |
#3 | Germany | 3 | |
#4 | Mexico | 3 | |
#5 | Brazil | 2 | |
#6 | Republic of Korea | 2 | |
#7 | United States | 2 | |
#8 | Canada | 1 |
# | Industry | |
---|---|---|
#1 | Computer technology | |
#2 | Telecommunications | |
#3 | Audio-visual technology | |
#4 | Semiconductors | |
#5 | Machines | |
#6 | Packaging and shipping | |
#7 | Transport |
# | Technology | |
---|---|---|
#1 | Data recognition and presentation | |
#2 | Antennas | |
#3 | Casings and printed circuits | |
#4 | Semiconductor devices | |
#5 | Hand carts | |
#6 | Shaping of plastics | |
#7 | Containers for goods storage | |
#8 | Certain plastics |
# | Name | Total Patents |
---|---|---|
#1 | Gallschuetz Sebastian | 8 |
#2 | Prescher Henry | 6 |
#3 | Ruprecht Harald | 6 |
#4 | Wagner Marco | 6 |
#5 | Kriebel Frank | 3 |
#6 | Kreutzer Andre | 3 |
#7 | Schaefer Michael | 3 |
#8 | Semar Robert | 3 |
#9 | Reppe Thomas | 2 |
#10 | Seidowski Thomas | 2 |
Publication | Filing date | Title |
---|---|---|
WO2011032856A1 | Rfid label | |
KR20110084291A | Method for producing an rfid transponder product, and rfid transponder product produced using the method | |
WO2010034820A1 | Rfid transponder antenna | |
EP2054846A1 | Method for the production of a container, and container for storing and transporting piece goods and bulk material | |
DE102007028357A1 | transponder card | |
DE102005042444A1 | Arrangement for an RFID transponder antenna | |
DE102004054223A1 | Multi-layer flexible printed circuit board with opposite flexible conductive structures and method for their production | |
EP1155445A1 | Method for producing electrically conductive connections | |
EP1133796A1 | A method for producing a two-dimensional support for semiconductor chips |