Learn more

KODENSHI CORP

Overview
  • Total Patents
    62
  • GoodIP Patent Rank
    126,430
About

KODENSHI CORP has a total of 62 patent applications. Its first patent ever was published in 1985. It filed its patents most often in Japan, China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, measurement and electrical machinery and energy are KEMMER JOSEF DR, SEV MOTOROLA and HATORI MAKOTO.

Patent filings in countries

World map showing KODENSHI CORPs patent filings in countries

Patent filings per year

Chart showing KODENSHI CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shimizu Katsuya 9
#2 Fukuda Eiji 5
#3 Fukuda Hideji 5
#4 Kimata Masaaki 4
#5 Tokuda Atsushi 4
#6 Bando Takeshi 4
#7 Takahata Akihiro 4
#8 Uchiyama Keisuke 3
#9 Hirata Mai 3
#10 Fukui Hiroyuki 3

Latest patents

Publication Filing date Title
JP2020184147A Gesture recognition device and program for gesture recognition device
JP2020071202A Moving object detection system and program for moving object detection system
JP2020021816A Passage detection sensor
JP2019211312A Reflection type optical sensor and reflection type encoder using the same
JP2019211311A Reflection type optical sensor and reflection type encoder using the same
JP2019184437A Optical sensor and counter
JP2018019013A Optical sensor
JP2017135130A Light emitting apparatus
JP2017072453A Light reception device and position detection device
JP2017067541A Detection device
JP2017020967A Rotary encoder
JP2013213829A End portion detection device of moving body
JP2014188773A Ink cartridge
JP2014175607A Optical sensor
CN104067487A Encoder sensor mounting body, drum disk encoder, and motor with encoder using same
CN103620349A Scale for rotary encoder, method of injection-molding same, and rotary encoder using same
JP2013217880A Optical encoder
JP2012164518A Wide orientation lighting system and its manufacturing method
CN102097340A Method for manufacturing SMD (surface mounted device) by COB (chip on board) glue filling and encapsulating
JP2011179828A Multi-wavelength infrared array sensor