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KEHUA NEW MAT TAIZHOU CO LTD

Overview
  • Total Patents
    24
  • GoodIP Patent Rank
    69,053
  • Filing trend
    ⇧ 50.0%
About

KEHUA NEW MAT TAIZHOU CO LTD has a total of 24 patent applications. It increased the IP activity by 50.0%. Its first patent ever was published in 2015. It filed its patents most often in China. Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and semiconductors are ANHUI ARAM SEALS CO LTD, ANHUI DUBANG ELECTRICAL APPLIANCE CO LTD and SUZHOU SHUFANXIN ELECTRONIC TECH CO LTD.

Patent filings in countries

World map showing KEHUA NEW MAT TAIZHOU CO LTDs patent filings in countries
# Country Total Patents
#1 China 24

Patent filings per year

Chart showing KEHUA NEW MAT TAIZHOU CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Shanxue 24
#2 Li Gang 24
#3 Lu Xukui 24
#4 Li Hailiang 24
#5 Wang Hanjie 4
#6 Li Jianrong 2
#7 Li Zhuo 2
#8 Xu Wei 2
#9 Zhou Hongtao 2
#10 Yang Xinhao 2

Latest patents

Publication Filing date Title
CN111218092A Processing method of light-color yellowing-resistant epoxy resin composition for packaging
CN111205796A Light-colored anti-yellowing epoxy resin composition for semiconductor packaging
CN111113716A Method for improving appearance of product packaged by epoxy plastic packaging material
CN111117158A Low-cost low-stress epoxy composition and preparation method thereof
CN111073217A High-thermal-conductivity low-stress epoxy plastic packaging material for semiconductor packaging
CN111117540A High-strength high-heat-resistance epoxy plastic packaging material for organic bentonite modified semiconductor packaging and preparation method thereof
CN109467881A A kind of super heat-resisting, high thermal conductivity epoxy-plastic packaging material of semiconductor-sealing-purpose
CN109370160A A kind of epoxy molding plastic and preparation method thereof that powder fiber is modified
CN109461665A The method for improving the semiconductor device reliability of composition epoxy resin encapsulation
CN109517335A A kind of moulding compound composition epoxy resin and preparation method thereof
CN109467880A A method of improving the semiconductor device reliability of composition epoxy resin encapsulation
CN109517336A A kind of super heat-resisting, high thermal conductivity epoxy-plastic packaging material preparation method of semiconductor-sealing-purpose
CN108164979A A kind of polyurethane modified epoxy resin composition for semiconductor packages
CN108117724A It is a kind of for semiconductor-sealing-purpose can normal temperature storage type ring epoxy resin composition
CN107955335A A kind of composition epoxy resin preparation method prepared using mixer
CN108129802A A kind of composition epoxy resin preparation method of semiconductor-sealing-purpose
CN106674911A High-adhesion epoxy molding compound for packaging semiconductor
CN106589827A Environmentally-friendly epoxy resin composition with good storability, and preparation method thereof
CN106674910A Low-stress epoxy plastic packaging material for semiconductor packaging
CN106589828A Environment-friendly epoxy resin composition and preparation method thereof