JONAS & REDMANN AUTOMATIONSTECHNIK GMBH has a total of 35 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 2007. It filed its patents most often in Taiwan, Germany and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, environmental technology and machines are SHIMIZU TATSUO, AOKI TOMOYUKI and RAMANATHAN SHRIRAM.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 8 | |
#2 | Germany | 7 | |
#3 | WIPO (World Intellectual Property Organization) | 5 | |
#4 | EPO (European Patent Office) | 4 | |
#5 | Canada | 2 | |
#6 | China | 2 | |
#7 | Republic of Korea | 2 | |
#8 | Malaysia | 2 | |
#9 | United States | 2 | |
#10 | Hungary | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Environmental technology | |
#3 | Machines | |
#4 | Electrical machinery and energy | |
#5 | Packaging and shipping | |
#6 | Audio-visual technology | |
#7 | Textiles and paper |
# | Name | Total Patents |
---|---|---|
#1 | Redmann Lutz | 22 |
#2 | Jonas Stefan | 9 |
#3 | Venhues Lars | 6 |
#4 | Lutz Redmann | 4 |
#5 | Uriarte Claudio | 3 |
#6 | Stefan Jonas | 3 |
#7 | Gensicke Tobias | 3 |
#8 | Anders Olaf | 3 |
#9 | Merscher Michael | 3 |
#10 | Hartwig Robert | 2 |
Publication | Filing date | Title |
---|---|---|
DE102018207350A1 | Device for receiving a plurality of components | |
DE102017222963A1 | Method and device for transporting substrates | |
DE102017217519A1 | Arrangement and method for positioning components and lifting the components of a receiving device | |
DE102017217304A1 | Method and device for transporting substrates | |
DE102016214787A1 | Winding device and method for producing flat coils | |
DE102013008100A1 | Device for changing distances between individual substrates | |
DE102012019975B3 | Device for producing electrode stacks | |
TW201130068A | Method and device for realizing stacked back-to-back wafer lot | |
TW200921824A | Mounting device for disk-shaped substrates such as solar wafers | |
EP2167285A1 | Gripper system with a bernoulli gripper for receiving planar components such as silicon-based wafers |