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JOHNSON MATTHEY INC

Overview
  • Total Patents
    253
About

JOHNSON MATTHEY INC has a total of 253 patent applications. Its first patent ever was published in 1976. It filed its patents most often in United States, Japan and EPO (European Patent Office). Its main competitors in its focus markets chemical engineering, pharmaceuticals and semiconductors are NIPPON STEEL SUMIKIN MAT CO LTD, GUOBIAO ZHANG and IIJIMA TADASHI.

Patent filings per year

Chart showing JOHNSON MATTHEY INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Abrams Michael J 38
#2 Nguyen My N 26
#3 Giandomenico Christen M 22
#4 Schwartz David A 19
#5 Vollano Jean F 17
#6 Murrer Barry A 13
#7 Heffernen Steven A 13
#8 Hochella William A 13
#9 Zubieta Jon A 13
#10 Nguyen My Nhu 11

Latest patents

Publication Filing date Title
KR20140011350A High-temperature scr catalyst
CN102811796A A system and method to gasify aqueous urea into ammonia vapors using secondary flue gases
EP2318682A1 Emission reduction system for use with a heat recovery steam generation system
US2009274601A1 Method of reducing nitrogen oxides in a gas stream with vaporized ammonia
US6451422B1 Thermal interface materials
US5989459A Compliant and crosslinkable thermal interface materials
US6057402A Long and short-chain cycloaliphatic epoxy resins with cyanate ester
US6117930A Resin systems for organosilicon-containing compositions
US5961753A Enhancement of mechanical properties for selective platinum group metal alloy systems by age hardening
US5955044A Method and apparatus for making ultra-pure hydrogen
US5859110A Method of decreasing bleed from organic-based formulations and anti-bleed compostitions
US5744533A Adhesive composition for bonding a semiconductor device
US5912316A Flexible interpenetrating networks formed by epoxy-cyanate ester compositions via a polyamide
US5859105A Organosilicon-containing compositions capable of rapid curing at low temperature
US5852092A Organosilicon-containing compositions having enhanced adhesive properties
US5708129A Die attach adhesive with reduced resin bleed
US5783621A Method of decreasing bleed fom organic-based formulations and anti-bleed compositions
US5855821A Materials for semiconductor device assemblies
HU210872A9 Pt(iv)complexes
US5524422A Materials with low moisture outgassing properties and method of reducing moisture content of hermetic packages containing semiconductor devices