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JIANGYIN SAIYING ELECTRON CO LTD

Overview
  • Total Patents
    15
  • GoodIP Patent Rank
    178,405
  • Filing trend
    0.0%
About

JIANGYIN SAIYING ELECTRON CO LTD has a total of 15 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 2008. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are KING DRAGON INTERNAT INC, CHONG DAVID and ECO SEMICONDUCTORS LTD.

Patent filings in countries

World map showing JIANGYIN SAIYING ELECTRON CO LTDs patent filings in countries
# Country Total Patents
#1 China 15

Patent filings per year

Chart showing JIANGYIN SAIYING ELECTRON CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Zhang Qiong 8
#2 Chen Guoxian 7
#3 Xu Hongwei 7
#4 Hongwei Xu 5
#5 Chen Qiang 5
#6 Guoxian Chen 4
#7 Beilu Chen 3
#8 Chen Beilu 2
#9 Jianbiao Geng 2
#10 Feng Zhang 1

Latest patents

Publication Filing date Title
CN108550560A A kind of New IGBT module copper soleplate structure
CN108766944A A kind of soft start thyristor radiator and its method of surface finish
CN107768314A A kind of flat board elastic compression joint encapsulation IGBT ceramic cartridges and preparation method
CN107610850A A kind of superpower high pressure high-insulativity ceramic cartridge
CN106783749A A kind of super large-scale ceramic package structure
CN105448847A Ceramic package housing with external electrodes
CN105448849A Ceramic package housing with replaceable internal electrodes
CN105448848A Ceramic package housing with internal multi-stand electrode for IGBT
CN103426829A High-power ceramic-packaged IGBT (insulated gate bipolar transistor) efficient two-side-cooling integral tube shell
CN102768997A High-power complete wafer IGBT (insulated gate bipolar translator) ceramic package housing
CN102768999A High-power integral wafer IGBT (insulated gate bipolar transistor) packaging structure
CN101877332A Novel plate pressure welding type multichip packaging ceramic package
CN101916745A Novel plate crimped dual-chip encapsulated ceramic package
CN101399237A Rapid heat radiation ceramic case formed by full compression joint
CN101266952A Novel full-press high-power IGBT multi-mode rack porcelain tube shell