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JIANGSU CONTENT NETWORKING RES & DEV CT

Overview
  • Total Patents
    41
About

JIANGSU CONTENT NETWORKING RES & DEV CT has a total of 41 patent applications. Its first patent ever was published in 2011. It filed its patents most often in China. Its main competitors in its focus markets telecommunications, semiconductors and measurement are ARTILUX INC, IRIS IND SA and TRIEYE LTD.

Patent filings in countries

World map showing JIANGSU CONTENT NETWORKING RES & DEV CTs patent filings in countries
# Country Total Patents
#1 China 41

Patent filings per year

Chart showing JIANGSU CONTENT NETWORKING RES & DEV CTs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Huang Kui 6
#2 Gao Yang 4
#3 Liu Yuchan 4
#4 Li Xiaodong 4
#5 Xu Gaosong 4
#6 Yu Daquan 3
#7 Shen Wei 3
#8 Wang Weibing 3
#9 Chen Shudong 3
#10 Yu Shuizhong 3

Latest patents

Publication Filing date Title
CN103442099A Network service cooperation method between heterogeneous systems
CN103441884A SOA service quality monitoring system based on cross-layer framework
CN103440488A Method for identifying pest
CN103441741A Operational amplifying circuit structure reducing offset voltage based on band-gap reference
CN103440076A Three-dimensional multiple-point type touch screen based on thin film pressure sensors and triaxial accelerometer
CN103391101A Mono-pulse time-domain amplifier based on charge-discharge structure
CN103391215A Remote software downloading and updating method, device and system based on chain network
CN103267775A Micro-nano-scale material seebeck coefficient online measurement method
CN103200283A Multi-relay wireless communication system and method for realizing IP (Internet Protocol)-based air interface for same
CN103269243A Wireless communication relay device, system and communication method
CN103196567A Diode infrared detector and reading circuit thereof
CN103198126A Spatial-temporal data managing method for Internet of Things
CN103196724A Preparation method of in-situ tensile sample for TSV (through-silicon-via) copper-interconnection material mechanics performance test
CN103117302A Back structure of FS type IGBT(Insulated Gate Bipolar Transistor)device
CN103165479A Manufacture method of multi-chip and system-level packaging structure
CN103111127A PM 2.5 filtration structure and preparation method thereof
CN103116643A Hadoop-based intelligent medical data management method
CN103118440A Construction method of dynamic mesh of vehicle-mounted ad hoc network
CN103117009A Digital classroom system based on cloud storage service
CN102976262A Optically-measurable MEMS (Micro-electromechanical System) encapsulating structure provided with sealing cap electrode