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JF MICROTECHNOLOGY SDN BHD

Overview
  • Total Patents
    51
  • GoodIP Patent Rank
    37,945
  • Filing trend
    ⇧ 100.0%
About

JF MICROTECHNOLOGY SDN BHD has a total of 51 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 2010. It filed its patents most often in United States, Philippines and China. Its main competitors in its focus markets measurement, electrical machinery and energy and machines are EVERETT CHARLES TECH, UNITECHNO INC and HWANG DONG WEON.

Patent filings per year

Chart showing JF MICROTECHNOLOGY SDN BHDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Foong Wei Kuong 47
#2 Goh Kok Sing 44
#3 Lee Eng Kiat 42
#4 Mundiyath Shamal 40
#5 Chin Mei Chen 9
#6 Shamal Mundiyath 6
#7 Roslee Muhamad Izzat Bin 3
#8 Bin Roslee Muhamad Izzat 3
#9 Sing Goh Kok 3
#10 Kuong Foong Wei 3

Latest patents

Publication Filing date Title
SG10202004742XA Wedged Contact Fingers For Integrated Circuit Testing Apparatus
CN110673012A Electrical contact for integrated circuit test equipment and integrated circuit test equipment
PH12019050032A1 Horizontal clamp electrical contact assembly
US2019067861A1 Low inductance electrical contact assembly
US2019064260A1 Low inductance electrical contact assembly manufacturing process
US2018313869A1 Short contact with multifunctional elastomer
PH12018050191A1 High precision vertical motion kelvin contact assembly
PH12018050194A1 Manufacturing process for kelvin contact assembly housing
US2017244189A1 Spring contact in a testing apparatus for integrated circuits
CN107102250A Kelvin contact part component and its installation method
US2017219624A1 Kelvin contact assembly in a testing apparatus for integrated circuits
TW201623970A Contact assembly in a testing apparatus for integrated circuits and a method of assembling thereof
TW201626647A Short contact in a testing apparatus for wireless integrated circuits
SG10201407661VA Compressible Layer With Integrated Bridge In IC Testing Apparatus
US2013249583A1 Multiple rigid contact solution for IC testing
MY168237A Ground contact of an integrated circuit testing apparatus
MY160080A Interlinked contact module for ic testing
MY167107A An electrical interconnect assembly
SG195107A1 An electrical interconnect assembly
WO2011145916A1 An electrical interconnect assembly and a test contact for an electrical interconnect assembly