Method and device for creating a pattern for a workpiece and workpiece
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Method for producing a weakening line in a cover by material removal
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Method and apparatus for generating dynamic scanner figures for machining a workpiece
DE102013018654A1
Method and device for detecting and correcting a spatial position of a workpiece held in a positioning device
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Devices for connecting two workpiece parts by means of laser transmission welding
DE102013104599B3
Apparatus, useful for transmission welding of inner circumferential surfaces of workpiece, comprises unit of laser beam having laser optics modules, and receptacle, where modules includes high power laser diode and conical mirror element
DE102013104138B3
Introducing defined line of weakness by removal of material to fibrous covering material, comprises directing pulsed laser beam to rear side of material and linearly guiding, and determining depth of score line of impingement of laser beam
DE102013003118A1
A method for disposing of a Bußens incurred in a perforation process of a hollow section
DE102013101224A1
Laser transmission welding apparatus, laser transmission welding method, and a film sealed container therewith
DE102012110165A1
Device for connecting two workpiece parts with areas of different properties by means of transmission welding
DE102012109245B3
Method and device for machining non-rotationally symmetrical workpieces by means of laser radiation
DE102012104230A1
Device, used to introduce structure lines in thin film-photovoltaic modules, includes workpiece holder, laser beam source, laser beam directing unit and unit for guiding beam along structure line in intensity distribution graduating optics
DE102012103176B3
Apparatus and method for introducing separation cracks into a substrate
DE102011055203A1
Device for connecting two workpiece parts via a weld by means of transmission welding
DE102011052444A1
Process for the linear structuring of a coated substrate for the production of thin-film solar cell modules
CN102485405A
Method used for producing single layer covering object of air bag
DE102011051636A1
Device for joining workpieces
DE102011001879A1
Device for clamping wafer utilized in e.g. micro system technology, has suction port connected with vacuum ejector via distributor, and suction insert provided in suction port and includes resilient hollow body opened at its two sides
DE102010047917A1
Device for simultaneous circumferential machining of a workpiece with laser beams
DE102010032029A1
Method for separating a round flat plate made of brittle material into several rectangular individual plates by means of laser
